分类

硅电容器

376
硅电容器和薄膜电容器属于特种器件,其制造工艺、技术手段及材料均沿用了半导体器件生产的通用方法与材料。由此实现的极高精度与严格控制,使得这类电容器能够达到近乎理想的性能,并具备优异的参数稳定性;尽管其容值范围相对有限,且相较于与其直接竞争的陶瓷基电容器而言成本较高。
产品 描述 RoHS 价格 库存 数量
RFCS04025000DBTWS
RFCS04025000DBTWS
封装: Tray
CAP SILICON 0.5PF 50V 0402
RoHS
库存: 1600
RFCS04025000DBGWS
RFCS04025000DBGWS
封装: Tray
CAP SILICON 0.5PF 50V 0402
RoHS
库存: 1600
RFCS04024700CJTWS
RFCS04024700CJTWS
封装: Tray
CAP SILICON 4.7PF 25V 0402
RoHS
库存: 1600
RFCS04024000DBTWS
RFCS04024000DBTWS
封装: Tray
CAP SILICON 0.4PF 50V 0402
RoHS
库存: 1600
RFCS04023300CJTWS
RFCS04023300CJTWS
封装: Tray
CAP SILICON 3.3PF 25V 0402
RoHS
库存: 1600
RFCS04023900CJTWS
RFCS04023900CJTWS
封装: Tray
CAP SILICON 3.9PF 25V 0402
RoHS
库存: 1600
RFCS04022700CJTWS
RFCS04022700CJTWS
封装: Tray
CAP SILICON 2.7PF 50V 0402
RoHS
库存: 1600
RFCS04022700CKTWS
RFCS04022700CKTWS
封装: Tray
CAP SILICON 2.7PF 50V 0402
RoHS
库存: 1600
RFCS04023000DBGWS
RFCS04023000DBGWS
封装: Tray
CAP SILICON 0.3PF 50V 0402
RoHS
库存: 1600
RFCS04023000DBTWS
RFCS04023000DBTWS
封装: Tray
CAP SILICON 0.3PF 50V 0402
RoHS
库存: 1600
RFCS04022700BJTWS
RFCS04022700BJTWS
封装: Tray
CAP SILICON 27PF 10V 0402
RoHS
库存: 1600
RFCS04022200CJTWS
RFCS04022200CJTWS
封装: Tray
CAP SILICON 2.2PF 50V 0402
RoHS
库存: 1600