分类

硅电容器

376
硅电容器和薄膜电容器属于特种器件,其制造工艺、技术手段及材料均沿用了半导体器件生产的通用方法与材料。由此实现的极高精度与严格控制,使得这类电容器能够达到近乎理想的性能,并具备优异的参数稳定性;尽管其容值范围相对有限,且相较于与其直接竞争的陶瓷基电容器而言成本较高。
产品 描述 RoHS 价格 库存 数量
913R7K-BSP-1
913R7K-BSP-1
封装: Bulk
DIE, BINARY CAPACITOR, 3.7 PF +/
RoHS
库存: 1600
910R3K
910R3K
封装: Bulk
CAPACITOR,DIE,0.3 PF +/-10%
RoHS
库存: 1600
9147RK-SP12
9147RK-SP12
封装: Bulk
DIE, MOUNTING CAPACITOR, 47PF +/
RoHS
库存: 1600
9115R0K-BSP-1
9115R0K-BSP-1
封装: Bulk
DIE, BINARY CAPACITOR, 15PF +/-1
RoHS
库存: 1600
911R5M-BSP3
911R5M-BSP3
封装: Bulk
CAP SILICON 1.5PF 20% 100V DIE
RoHS
库存: 1600
912R5J
912R5J
封装: Bulk
CAPACITOR,2.5 PF +/-5%,DIE
RoHS
库存: 1600
9147RM
9147RM
封装: Bulk
CAP SILICON 47PF 20% 100V DIE
RoHS
库存: 1600
915R0K
915R0K
封装: Bulk
DIE, CAPACITOR, 5 PF +/-10%
RoHS
库存: 1600
910R6K
910R6K
封装: Bulk
CAPACITOR,0.6 PF +/-10%,DIE
RoHS
库存: 1600
910R8J
910R8J
封装: Bulk
DIE, CAPACITOR, 0.8 PF +/-5%
RoHS
库存: 1600
MBC50-47B13
MBC50-47B13
封装: Bulk
CAP SILICON 47PF 20% 50V SMD
RoHS
库存: 1600
9145RK-SP14
9145RK-SP14
封装: Bulk
45 PF CHIP CAP, 20X40
RoHS
库存: 1600